PCB CAPABILITIES
Amitron's team of professionally trained CAD/CAM engineers assure a seamless transition of your engineering data to the manufacturing floor. The following information outlines our engineering and manufacturing capabilities.

Layer Count: Single – 30 layers
Laminate Types: FR-4 (140Tg, 170Tg, 180Tg) (all UL94V-0 rated), RF and Teflon, Arlon, Getek, Rogers, Nelco and more! Thermal materials including Laird, Arlon, Ventec, Iteq and Chin-Shi, bonded to Aluminum or Copper.
Laminate Thickness: 0.003" to 0.250"
Copper Weight: 1/2 ounce to 20 ounce, finished
Line & Space Widths: 0.003"/0.003"
Solder Mask over Bare Copper (SMOBC)
Solder Mask: LPI & SR1000
Carbon Ink
Gold Tab Plating
Electroless Nickel Immersion Gold (ENIG)
Lead-free HASL
OSP
Immersion Silver or Tin
Gerber
DXF
HPGL
ASCII
EIA
ODB++
DPF
Orbotech Genesis Software
Micro-modifications
Panel/ Array Optimization
Pre-manufacturing Design Checks
Artwork Generation from Bare Boards or Blueprints
Net List Test Fixture Generation
Minimum annular ring: | .004" |
Board edge to edge, routed: | +/- 0.005" |
Tooling hole to hole: | +/- 0.002" |
Tooling hole to edge: | +/- 0.005" |
Holes to copper registration: | +/- 0.003" |
Top to bottom registration: | +/- 0.003" |
Image line tolerance: | 90% art work |
Scoring tolerance: | +/- 0.005" |
Edge to copper: | +/- 0.008" |
Minimum Solder mask clearance: | 0.002" |
Minimum hole size: | 0.008" |
Minimum inside radius: | 0.011" |
Minimum trace width: | 0.003" |
Pad to pad clearance: | 0.002" |
Hole diameter (plated thru): | +/- 0.0025" |
Hole diameter(non-plated up to .250"): |
+/- 0.001" |